Design & Characterization

As the electronics industry moves towards more complex semiconductor packages that are smaller, faster, and higher performance, engineers are faced with the challenge of trying to fit more powerful components into a smaller area without causing long-term reliability issues or stress on a package. Delivering the optimum package design requires an in-depth analysis of key package measurements and simulation.

Revopex’s worldwide package characterization teams located in US, APAC and Europe countries,provide advanced package characterization services for our global customers to ensure they have high quality, high performance, reliable, and cost-effective package designs that meet their market requirements.